ICCAD中国集成电路设计业2020年会（重庆）
会议接待
会场展区待
高峰论坛
展区搭建
会议日程
2Dec. 10, Thursday, 2020 地点：重庆悦来国际会议中心三楼两江厅 Venue: Liangjiang Grand Ballroom, 3F, Chongqing Yuelai International Convention Center | |
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| 时间 Time | 内容 Contents |
Opening Ceremony | |
Moderator: Leader of Chongqing Economic and Information Technology Commission | |
| 08:30-09:00 | 中国半导体行业协会领导致词 Address, Leader of CSIA |
| 领导、嘉宾致辞 Address, Leader and Guest | |
| 重庆市人民政府领导致辞 Address, Leader of Chongqing Municipal People's Government | |
Top Forum | |
Moderator: Jinge Cheng, General Secretary, CSIA-ICCAD | |
| 09:00-09:30 | 主旨报告 魏少军教授，中国半导体行业协会集成电路设计分会理事长 Keynote Prof. Shaojun Wei, General Director, CSIA-ICCAD |
| 09:00-09:30 | 重庆市集成电路产业发展情况 重庆市经济和信息化委员会领导 Chongqing IC Industry Development Situation Leader, Chongqing Economic and Information Technology Commission |
| 09:50-10:10 | 陈立武，Cadence首席执行官 |
| 10:10-10:30 | 对半导体产业成长的展望 陈平博士，台积电（中国）副总经理 Semiconductor Growth Outlook Dr. Peter Chen, Vice President, TSMC China Business Development |
| 10:30-10:50 | From Mentor EDA to Siemens EDA 彭启煌，全球高级副总裁&亚太区总裁，Mentor, a Siemens business From Mentor EDA to Siemens EDA Danny Perng, Senior Vice President, PacRim, Mentor, a Siemens business |
| 10:50-11:10 | 同芯同力，共行致远 葛群，新思科技中国董事长兼全球资深副总裁 One Chip, One World Qun Ge, Synopsys China Chairman and Global Senior Vice President |
| 11:10-11:30 | 芯火燎原，科创未来 戴伟民，芯原股份创始人，董事长兼总裁 SiPaaS Enables Intelligence of Everything Wayne Dai, Founder, Chairman, President and CEO, VeriSilicon |
| 11:30-11:50 | 自强自立，共建国产RTL-GDSII数字全流程设计智能平台 王宇成，深圳鸿芯微纳技术有限公司首席技术官 The Introduction of the First Production-Ready RTL-GDSII Digital Design Smart Platform Made by a Chinese Company Yucheng Wang, CTO, Shenzhen Giga Design Automation Co., Ltd. |
| 11:50-13:15 | 自助午餐 Buffet Lunch |
Moderator: Mr. Datong Chen, Vice General Director, CSIA-ICCAD | |
| 13:15-13:20 | 幸运抽奖 Lucky Draw |
| 13:20-13:40 | 晶圆代工服务：结合当地制造和产品差异化 林伟圣，和舰芯片制造（苏州）股份有限公司销售副总经理 Advantage Of Both Worlds: When Local Manufacture Meets Product Differentiation W S Lin, Sales VP, HeJian Technology (Suzhou) Co., Ltd. |
| 13:40-14:00 | 芯起点 创未来 彭进，中芯国际集成电路制造有限公司资深副总裁 Advantage Of Both Worlds: When Local Manufacture Meets Product Differentiation W S Lin, Sales VP, HeJian Technology (Suzhou) Co., Ltd. |
| 14:00-14:20 | 展望Arm计算新时代 吴雄昂，安谋中国执行董事长兼CEO The New Era of Arm Computing Allen Wu, Executive Chairman & CEO, Arm China |
| 14:20-14:40 | 华大九天—助力产业人才培养 郭继旺，北京华大九天软件有限公司副总经理 Empyrean Software Empower Talent Development Jiwang Guo, Vice President, Huada Empyrean Software Co., Ltd. |
| 14:40-15:00 | 通过加速数字化转型，从“新常态”到“更好常态” 孙以山，格芯亚太区业务发展资深总监 From 'New Normal' to a 'Better Normal' Through Accelerated Digital Transformation Michael Sun, Senior Director, Asia Business Development， GLOBALFOUNDRIES |
| 15:00-15:20 | 赛昉科技引领RISC-V生态发展 徐滔，赛昉科技有限公司CEO StarFive Leads RISC-V Ecosystem Development Thomas Xu, CEO, StarFive Technology Co., Ltd. |
| 15:20-15:35 | 茶歇，交流，抽奖Coffee Break, Lucky Draw |
| 15:35-15:55 | 助力国产芯片自主可控一一新时期IP公司的机遇与挑战 邹铮贤，四川和芯微电子股份有限公司董事长兼CEO Helping Domestic Chips to be Independently & Controllable- Opportunities & Challenges for IP companies in the new Era Jackie Zou, President & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd. |
| 15:55-16:15 | 服务先行 创新驱动 人才为本 时龙兴，东南大学首席教授，南京集成电路产业服务中心(ICisC)主任，南京集成电路大学校长 Service first, Innovation as Driving Force, Talent is Fundamental Prof. Longxing Shi, Currently the Chief Professor of Southeast University, the Director of Nanjing Integrated Circuit Industry Service Center (ICisC), The Headmaster of Nanjing IC University |
| 16:15-16:35 | 新市场+新格局 本土IP迎新机遇 向建军，成都锐成芯微科技股份有限公司董事长 The Opportunities of Local IP Industry Brought by Current Markets Environment Jianjun Xiang, Chairman, Chengdu Analog Circuit Technology Inc. |
| 16:35-16:55 | 新时期第三方专业芯片测试的机遇与挑战 张亦锋，广东利扬芯片测试股份有限公司 CEO The opportunities and challenges of third party IC testing in the new era Yeefeng Zhang, CEO, Guangdong Leadyo IC Testing Co., Ltd. |
| 16:55-17:15 | 数字经济双循环，EDA技术突破正当时 王礼宾，芯华章科技创始人、董事长兼CEO The Dual Circulation of Digital Economy Lays Ground for Breakthrough in EDA Technology Alex Wang, Founder, Chairman and CEO, X-EPIC |
| 17:15-17:35 | 服务中国芯创业者的思考和探索 摩尔精英MooreElite Innovation Way to Serve IC Design Start-ups in China JY Zhang, Chairman & CEO, MooreElite |
| 17:35-17:40 | 幸运抽奖 Lucky Draw |
| 17:40-19:00 | 观展与交流 Visiting Exhibition |
| 19:00-21:00 | 欢迎晚宴（Cadence公司赞助） Welcome Dinner Banquet (Sponsored by Cadence) 地点：重庆悦来国际会议中心三楼两江厅 Site: Liangjiang Grand Ballroom, Chongqing Yuelai International Convention Center |
Dec. 11, Friday, 2020 专题论坛（一） Subject Forum (I) 地点：重庆悦来国际会议中心一楼欢悦厅A Venue: Fabulous Function A, 1F, Chongqing Yuelai International Convention Center | ||
|---|---|---|
| 时间 Time | 内容 Contents | 演讲人 Lecturer |
EDA and IC Design Innovation | ||
Moderator: Lei Shen, Vice General Director, CSIA-ICCAD | ||
| 08:40-09:00 | 通过流程重心左移，加速先进技术下的设计实现 Speeding Up Advanced Node Design Implementation by Shifting Left | 汤木明，新思科技技术支持副总监 Muming Tang, Sr Manager Application Engineer, Synopsys |
| 09:00-09:20 | 机器学习，让EDA如虎添翼！ Delivering Improved Design Performance by Applying Machine Learning to EDA | 刘淼，Cadence公司高级资深总监 Miao Liu, Sr. Product Engineering Group Director, Cadence |
| 09:20-09:40 | 异构验证助力先进节点集成电路设计 Heterogeneous Verification Facilitates Advanced Node IC Design | 林俊雄，上海国微思尔芯技术股份有限公司首席执行官&总裁 Toshio Nakama, CEO & President, S2C Limited |
| 09:40-10:00 | 芯片异构集成——超越摩尔定律的时代 The Era of More to Moore – Chiplet Heterogeneous Integration | 李立基, 亚太区技术总监，Mentor, a Siemens business Lincoln Lee, Technical Director, Pacrim, Mentor, a Siemens business |
| 10:00-10:20 | 全流程工具助力电源管理芯片设计方法学创新 Methodology Innovation of Power Management IC Design on Complete AMS EDA System | 刘晓明，北京华大九天软件有限公司产品总监 Xiaoming Liu, Product Director, Huada Empyrean Software Co., Ltd. |
| 10:20-10:40 | 新一代技术与EDA的融合创新 Integration and Innovation of New Generation Technology and EDA Technology | 祝丹，芯华章科技商务拓展总监 Sarah Zhu, Director of Business Development, X-EPIC |
| 10:40-11:00 | 先进存储器设计的创新EDA解决方案 Innovation EDA Solution for Advanced Memory Design | 刘文超，上海概伦电子有限公司副总裁 Wenchao Liu, VP, Primarius Technologies Co., Ltd. |
| 11:00-11:20 | 3DIC芯片-封装-系统多物理场协同解决方案 3DIC Chip-Package-System Multiphysics Solutions | 姚欣，Ansys半导体事业部主任工程师 Xin Yao, Lead AE, Ansys Semiconductor BU |
| 11:20-11:40 | OpenEDI：一种开源的电子设计基础构件 OpenEDI: an Open-source Electronic Design Infrastructure | 陈刚，EDA创新中心研发副总经理 Michael Chen, R&D VP, Nanjing Industrial Innovation Center of EDA |
| 11:40-12:00 | Varman：值得信赖的工艺偏差良率分析方案 VarMan: The Trusted Variations-aware design solution | 刘客，芯师（上海）电子科技有限公司AE Manager KeLiu, AE Manager, Silvaco China., Ltd. |
| 12:00-12:05 | 幸运抽奖 Lucky Draw | |
| 12:05-13:10 | 自助午餐Buffet Lunch | |
Moderator: Na Liu, Vice General Secretary, CSIA-ICCAD | ||
| 13:10-13:30 | 先进工艺先进封装电磁仿真的挑战和应对 How to Address the Challenges from Advanced Process Nodes and Advanced Packaging | 苏周祥，芯和半导体高级技术支持经理 Zachary Su, AE Manager, Xpeedic Technology |
| 13:30-13:50 | 开源智能物联网处理器平台 Open CPU Platform for AIOT | 陈岚博士，中国科学院微电子研究所EDA中心主任 Dr. Lan Chen, Director, EDA Center of Institute of Microelectronics of the Chinese Academy of Sciences |
| 13:50-14:10 | 鸿之微ACAD——原子级TCAD应用解决方案 Hongzhiwei ACAD - Atomistic Level Solution for TCAD Application | 曹宇，鸿之微科技集成电路事业部经理 Yu Cao, Manager, Hongzhiwei Tech Co., Ltd. |
| 14:10-14:30 | 5G网络芯片的物理设计挑战与技术创新 Physical Design of 5G Networking Chips: Challenges and Innovations | 武辰飞，深圳市中兴微电子技术有限公司资深IC设计经理 Chenfei Wu, Snr. IC Design Manager, Sanechips Technology Co., Ltd. |
| 14:30-14:50 | 一站式EDA云端高性能计算平台 EDA Cloud High-Performance Computing Platform | 陈琳涛，上海速石信息科技有限公司高级技术总监 Leo Chen，Senior Director，Shanghai FASTONE Information Technology Co., Ltd. |
| 14:50-15:10 | 人才——IC产业创新发展的源动力 Talent - the driving force of IC industry innovation and development | 陈琳，成都源矽科技有限公司副总经理 Nemo Chen, VGM, Chengdu Yuan Xi Technology Co., Ltd. |
| 15:10-15:30 | 打造芯片实现工厂，做让客户满意的芯片 Build the Chip Implementation Foundry，Making Chips to Satisfy Customers | 闫银宝，上海申首半导体科技有限公司副总经理 Rimbo Yan, VP, Shanghai S1semi Technology Co., Ltd. |
| 15:30-15:50 | EDA 上云——加速中国“芯”时代 Accelerate Cloud Transformation - EDA on Azure | 孙海亮，微软中国半导体行业云负责人 Heidi Sun, Microsoft EDA Industry Executive |
| 15:50-16:10 | 成都芯谷产业发展路径 Chengdu IC Valley Industry Development Planning | 贺海华，中电光谷联合控股有限公司 副总裁、成都芯谷产业园发展有限公司总经理 Haihua He, Vice-President, Wuhan Optics Valley United Group LTD. |
| 16:10-16:30 | 智能时代的算力机遇 The Computing Opportunities in Intelligent Era | 欧阳剑，百度智能芯片总经理 Jian Ouyang, General Manager, Baidu Intelligent Chip |
| 16:30-16:50 | 以IC竞争力分析的视野深入洞悉ToF芯片 Insight into the ToF Chip with the Help of IC Competitiveness Analysis | 琪，苏州芯联成软件有限公司电路工程处经理 Qi Feng, Head of IC Analysis Department, Suzhou Silintech Company |
| 16:50-17:10 | 自主可控可信之高速网络芯片 Self-Controllable and Credible--High Speed Network Chip | 杨军，浙江滨芯科技有限公司CEO Jun Yang, CEO, BINXIN Technology (Zhejiang) Co., Ltd. |
| 17:10-17:30 | 达索系统助力半导体行业数字化转型 Dassault Systems Power the Digital Transformation of the Semiconductor Industry | 孙健，达索析统（上海）信息技术有限公司技术顾问 Jerry Sun, Industry Process Consultant, Dassault Systemes |
| 17:30-17:50 | 先进工艺下高性能芯片signoff挑战与EDA解决方案 High-performance Chip Signoff Challenges and EDA Solutions at Advanced Process Nodes | 贺青，杭州行芯科技有限公司CEO ing He, CEO, Hangzhou Phlexing Technology Co., Ltd. |
| 17:50-17:55 | 幸运抽奖Lucky Draw | |
| 18:30-20:00 | 闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点：重庆悦来国际会议中心一楼喜悦厅 Site: Fiesta Function, Chongqing Yuelai International Convention Center | |
Dec. 11, Friday, 2020 专题论坛（二） Subject Forum (II) 地点：重庆悦来国际会议中心一楼欢悦厅B Venue: Fabulous Function B, 1F, Chongqing Yuelai International Convention Center | ||
|---|---|---|
| 时间 Time | 内容 Contents | 演讲人 Lecturer |
IP and IC Design (I) | ||
Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD | ||
| 08:40-09:00 | 新思科技前沿IP解决方案 Synopsys IP Solutions at the New Era | 王迎春，新思科技IP高级技术经理 Yingchun Wang, Sr. Manager of IP Technology, Synopsys |
| 09:00-09:20 | 集成电路公共技术服务平台对产业发展的促进作用 The Promotion Effect of Public Technical Service Platform of IC on Industry Development | 李辉，南京集成电路产业服务中心（南京ICC）副总经理 Hui Li, Deputy General Manager, Nanjing IC Industry Service Center Co., LTD. |
| 09:20-09:40 | 星辰处理器赋能AIoT多样化应用 STAR Processor - Enabling Diversified AIoT Applications | 陈江杉，安谋中国高级产品经理 Jensen Chen, Senior Product Manager, Arm China |
| 09:40-10:00 | 基于芯原IP的高性能视频转码芯片和开源软件方案 High Performance Transcoding & Open Source Software Solution Based on VeriSilicon IP | 汪志伟，芯原股份副总裁，系统平台解决方案部总经理 Wiseway Wang, Vice President and General Manager of System Platform Solution Division, VeriSilicon |
| 10:00-10:20 | 赛昉科技惊鸿7100平台赋能AIoT时代 StarFive Jinghong 7100 Platform Powers AIoT Era | 周杰，赛昉科技有限公司销售总监 Jay Zhou, Sales Director, StarFive Technology Co., Ltd. |
| 10:20-10:40 | 面向各种新型应用的完整IP平台，助力产品创新 Complete IP Platform for Various New Applications Facilitates Product Innovation | 尚立峰，成都锐成芯微科技股份有限公司技术支持总监 Sam Shang, FAE Director, Chengdu Analog Circuit Technology Inc. |
| 10:40-11:00 | 连结未来：智原5G 网络通信硅智财解决方案 Link to the Future: Faraday 5G Networking IP Solutions | 孔晓彬，智原科技ASIC技术顾问 Bruce Kong, ASIC Technical Consultant, Faraday |
| 11:00-11:20 | “新基建” 时代， SOC助力5G网络部署 5G Network Powered by SOC in “New Infrastructure” Era | 郝冬艳，索喜科技（上海）有限公司市场总监 Dongyan Hao, Marketing Director, Socionext Technology(Shanghai) Co., Ltd. |
| 11:20-11:40 | 先进工艺节点上的IP到定制量产解决方案 Highly Customized IP and ASIC Solution for Cutting-edge Process Nodes | 高专，芯动科技DDR技术总监 Zachary Gao, DDR Technical Director, Innosilicon Technology Ltd. |
| 11:40-12:00 | 物理安全设计在新兴领域的必要性 The Necessary of Hardware-based Design Security in Emerging Industry | 胡逸众，深圳市纽创信安科技开发有限公司IP设计总监 Yizhong Hu, IP Design Director, Open Security Research, Inc. |
| 12:00-12:05 | 幸运抽奖Lucky Draw | |
| 12:05-13:10 | 自助午餐 Buffet Lunch | |
Moderator: Luqi Xu, Vice General Secretary, CSIA-ICCAD | ||
| 13:10-13:30 | 落地DTCO，助力中国半导体 From Data to Design Signoff: A Complete EDA Esco-system for DTCO enablement | 李严峰，概伦电子执行副总裁，首席产品官 Yanfeng Li, EVP, CPO Primarius Technologies |
| 13:30-13:50 | 台积公司设计生态系统促成创新 TSMC Ecosystem for Innovation | 韩晓峰，台积电技术支持资深经理 Evan Han, Technical Support Senior Manager, TSMC |
| 13:50-14:10 | 基于RISC-V指令集创建领域专用处理器 Creating Domain-Specific Processors Based on the RISC-V ISA | 相海英, Codasip中国总经理 Tina Xiang, China General Manager, Codasip |
| 14:10-14:30 | 基于TSMC先进2.5D/3D封装技术和GUC GLINK接口IP技术的Chiplets芯片系统互连方案设计实现 Enabling AI/ML, HPC & Networking Products Using TSMC 2.5D/3D Advanced Packaging Technology with GUC's Interface IPs | 肖有军，创意电子股份有限公司/上海设计中心总监 YJ Xiao, Director, Global Unichip Corporation (GUC)/CIDS |
| 14:30-14:50 | 雅特力科技——国产高效能Cortex-M4 MCU的创新领导者 Artery Tech-Innovative Leader of High-performance Cortex-M4 MCU | 陈佳延，雅特力科技(重庆)有限公司业务处长 Rick Chen, Sales Director, Artery Technology (Chongqing) Co., Ltd. |
| 14:50-15:10 | 基于Linux最小系统的产业链协同创新 Industry-Chain Collaborative Innovation of Linux Minimal System | 王路业，深圳优矽科技有限公司总经理 Luye Wang, CEO, Shenzhen UC Techip Co., Ltd. |
| 15:10-15:30 | RISC-V AI处理器中可变长向量指令在编译器和工具链中的支持 The Implementation of the Variable-length Vector Instructions on RISC-V AI Chips in the Compiler and Tool-chain | 王锋，湖南卡姆派乐信息科技有限公司CEO Feng Wang, CEO, Hunan Compiler Information Technology Co., Ltd. |
| 15:30-15:50 | Andes RISC-V完整解决方案 Andes’ RISC-V Total Solutions Fuel Momentum | 程明明，晶心科技技术服务经理 Albert Cheng, FAE Manager, Andes Technology |
| 15:50-16:10 | 国际化开放式创新平台，加速超越摩尔产业创新 An International Open Platform to Accelerate MtM Innovation | 曹明霞，上海微技术工业研究院总监 Jessica Cao, Director, SITRI |
| 16:10-16:30 | 5G时代基于异构多核技术的高端芯片定制化设计服务 Hi-end SoC Custom Design Services with Heterogeneous Technology in 5G Era | 谷建余，无锡华大国奇科技有限公司 CEO Jianyu Gu, CEO, Qualchip Technologies, Inc. |
| 16:30-16:50 | 紫光芯片设计云解决方案与最佳实践 UniGroup Cloud-based Solution & Best Practices for IC Design | 邓世友，紫光云技术有限公司 CTO办公室主任 Shiyou Deng, Director of UniCloud CTO Office, UNICLOUD TECH CO., LTD |
| 16:50-17:10 | 安路科技 | |
| 17:10-17:30 | SoC IP助力智能计算实现性能、功耗、面积新突破 SOC IP Enables Intelligent Computing Achieve New Breakthroughs in PPA | 郑凯，Imagination解决方案高级技术经理 Kai Zheng, Senior Solutions Engineering Manager, Imagination |
| 17:30-17:50 | 芯生态助力万物互联 IC Ecosystem Drive a Connected World | 王小华，紫光展锐（重庆）科技有限公司总经理 Xiaohua Wang, General Manager, UNISOC (Chongqing) Technologies Co., Ltd. |
| 17:50-17:55 | 幸运抽奖Lucky Draw | |
| 18:30-20:00 | 闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点：重庆悦来国际会议中心一楼喜悦厅 Site: Fiesta Function, Chongqing Yuelai International Convention Center | |
Dec. 11, Friday, 2020 专题论坛（三） Subject Forum (III) 地点：重庆悦来国际会议中心一楼欢悦厅C Venue: Fabulous Function, 1F, Chongqing Yuelai International Convention Center | ||
|---|---|---|
| 时间 Time | 内容 Contents | 演讲人 Lecturer |
IP and IC Design (II) | ||
Moderator: Jun Li, Vice General Secretary, CSIA-ICCAD | ||
| 08:40-09:00 | 差异化的竞争：先进特色工艺对5G应用产品的设计支持 Competition by Differentiation: Foundry’s Advanced Specialty Technology Platform Design Support for 5G Applications | 唐斌辉，和舰芯片制造（苏州）股份有限公司销售经理 Victor Tang, Sales Manager, HeJian Technology (Suzhou) Co., Ltd. |
| 09:00-09:20 | 破生态之殇，创技术之新 Breaking Ecological Dilemma and Creating New Technologies | 邹诚，上海睿赛德电子科技有限公司COO Leo Zou, COO, Shanghai Real Thread Elec Technology Beijing Co., Ltd. |
| 09:20-09:40 | 基于自主IP的高端通用异构芯片的设计和实践 Design and Practice of High-End Heterogeneous General-Purpose Chip Based on Indigenous Ips | 张立新博士，华夏芯（北京）通用技术处理器有限公司常务副总 Dr. Lixin Zhang, EVP, Huaxia General Processor Technologies Inc. |
| 09:40-10:00 | 芯片设计云计算发展规划 The Development Plan of IC Design Cloud Computing | 王汉杰，摩尔精英IT/CAD及云计算服务副总裁 Johnny Wang, Vice President of IT/CAD & EDA Cloud Service, MooreElite |
| 10:00-10:20 | IPGoal助力中国芯 IPGoal and the Fast-growing Chinese Chip | 罗培君，四川和芯微电子股份有限公司销售经理 Peijun Luo, Sales Manager, IPGoal Microelectronics (Sichuan) Co., Ltd. |
| 10:20-10:40 | Versatile, Wide Range Multiprotocol SerDes Solutions for Challenging Standards and Applications Including DisplayPort and PCIe5 | Andrew Cole, VP, Silicon Creations |
| 10:40-11:00 | 芯来科技基于RISC-V处理器的SOC IP平台 Nulei’s SOC IP Platform Based on RISC-V Processor IPs | 彭剑英，芯来科技执行总裁 Jianying Peng, Executive President, Nuclei |
| 11:00-11:20 | 灿芯助力中芯国际先进工艺及生态系统 What can Brite Bring to the SMIC Ecosystem? | 赵飞，灿芯半导体（上海）有限公司项目管理总监 imothy Zhao, TSM/PM Director ,Brite Semiconductor (Shanghai) Corporation |
| 11:20-11:40 | 多用途的SONOS非易失性存储器 Versatile SONOS Nonvolatile Memory | 禹小军，赛普拉斯半导体技术（上海）有限公司资深经理 Xiaojun Yu, Sr. Manager, Cypress Semiconductor Technology (Shanghai) Co., Ltd. |
| 11:40-12:00 | 通过灵活多变的多协议缓存一致性片上网络 (NoC) 优化异构SoC 架构 Optimizing Heterogenous SoC Architectures with Flexible Multiprotocol Cache Coherent Networks-on-Chip (NoC) | 曾品翰，Arteris IP应用工程和技术支持部门经理 William Tseng, FAE Manager, Arteris IP |
| 12:00-12:05 | 幸运抽奖Lucky Draw | |
| 12:05-13:10 | 自助午餐 Buffet Lunch | |
Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD | ||
| 13:10-13:30 | 先进制程高速集成电路ESD设计工程实现 ESD Protection Engineering Solutions for High-Speed IC’s in Advanced Technology Node | 吴召雷，成都纳能微电子有限公司研发部总监 ZL.Wu, R&D Director, Naneng Microelectronics |
| 13:30-13:50 | 设计服务的新形势 New Situation of Design Service | 王建中，上海佩纶半导体有限公司CEO Jianzhong Wang, CEO, peilunsemi |
| 13:50-14:10 | 新成熟工艺下的SPI NOR和SLC NAND SPI NOR and SLC NAND Flash in the Mature Process | 薛霆，北京兆易创新科技股份有限公司存储事业部市场经理 im Xue, Marketing Manger, GigaDevice Semiconductor (Beijing) Inc. |
| 14:10-14:30 | 芯片设计PCB化，全平台IP助力SoC芯片敏捷开发 ACTT IP Platform Enables Agile SoC Development | 杨毅，成都锐成芯微科技股份有限公司副总经理 Yi Yang, VP, Chengdu Analog Circuit Technology Inc. |
| 14:30-14:50 | 国产汽车电子关键技术突破与应用 Breakthrough and Application of Key Technology of Domestic Automotive Electronics | 肖佐楠，苏州国芯科技股份有限公司总经理 Joe Xiao, CEO, C*Core Technology Co., Ltd. |
| 14:50-15:10 | 从Silicon到Applications：IEEE全方位使能半导体技术的突破和发展 From Silicon to Applications: IEEE Enables Semi-conductor Technology Breakthrough in the Whole Eco-system | 李箐，IEEE亚太区区域经理 Li, Qing, IEEE APAC Area Manager |
| 15:10-15:30 | Securyzr iSE Automotive, 汽车芯片的安全方案 Securyzr iSE Automotive, The security solution for automotive chipset | 汪盛楠，Secure-IC大中华销售和市场经理 Shengnan WANG, Sales & Marketing Manager Greater China, Secure-IC |
| 15:30-15:50 | 从认证到加解密：探索安全芯片技术需求 From Authentication to Encryption: the Research and commercialization of Security Chip | 陈帅，飞思灵磐石安全实验室负责人 Shuai Chen, Sponsor and Director of Rock-solid Security Lab, Fisilink |
| 15:50-16:10 | 蓝牙低功耗（BLE）技术特点及其应用发展趋势微 Technical Features and Application Trends in Bluetooth Low Energy (BLE) | 张书迁，北京昂瑞微电子技术有限公司市场部高级总监 Shuqian Zhang, Senior Marketing Director, Beijing OnMicro Electronics Co., Ltd. |
| 16:10-16:30 | 立足国产替代，谋求创新发展——高云FPGA的自主之路 Gowin FPGA Development and Innovation Road | 王添平，广东高云半导体科技股份有限公司CTO TP Wang, CTO, Gowin Semiconductor Corp. |
| 16:30-16:50 | 基于RISC-V的嵌入式安全域IP SECURITY ENCLAVE Based on RISC-V | 谢林，Silex Insight大中华区负责人 Tony Tse, Head of Greater China, Silex Insight |
| 16:50-17:10 | 芯生态助力IC设计创新 CMOS Chip Managed to Boost IC Innovation in Design | 兰文丽，北京电子城集成电路设计服务有限公司总经理 Wenli Lan, General Manager, Beijing Electronics Zone Integrated Circuit Design and Service Co., Ltd. |
| 17:10-17:30 | 空间音频 – 新一代TWS耳机新体验 Next Generation TWS Design with 3D Audio and Sensor-fusion Solutions | 田元，CEVA商务拓展总监 Yuan Tian, Director of Business Development, CEVA |
| 17:30-17:50 | 基于自主IP的AI芯片设计和产品应用 AI SoC Design and Application Based on Proprietary IP | 麦振宇，亿智电子科技有限公司战略规划副总裁 Max Mai, VP of Strategy Planing, Eeasy Technology. Co., Ltd. |
| 17:50-17:55 | 幸运抽奖Lucky Draw | |
| 18:30-20:00 | 闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点：重庆悦来国际会议中心一楼喜悦厅 Site: Fiesta Function, Chongqing Yuelai International Convention Center | |
Dec. 11, Friday, 2020 专题论坛（四） Subject Forum (IV) 地点：重庆悦来国际会议中心一楼欣悦厅A Venue: Felicity Function A, 1F, Chongqing Yuelai International Convention Center | ||
|---|---|---|
| 时间 Time | 内容 Contents | 演讲人 Lecturer |
Foundry and Process Technology | ||
Moderator: Litian Zhang, Vice General Director, CSIA-ICCAD | ||
| 08:40-09:00 | 5G运用中的模拟芯片 Analog IC in 5G application | 秦磊，Tower Semiconductor中国区运营副总裁 Lei Qin, Vice President of China Operations, Tower Semiconductor Ltd. |
| 09:00-09:20 | 联电先进特色工艺 UMC Advanced Specialty Technologies | 陈剑波，和舰芯片制造（苏州）股份有限公司销售经理 Snowwolf Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd. |
| 09:20-09:40 | 先进特色工艺助力万物智联 Advanced Specialty Technologies Drive a Connected World | 田明，上海华力微电子有限公司研发总监 Ming Tian, Senior Director of TD, HLMC |
| 09:40-10:00 | SMC先进的工艺技术平台和系统整合解决方案 TSMC Advanced Technology Platforms & System Integration Solution | 孔玲，台积电(中国)有限公司业务副总监 Yoyo Kong, Deputy Director, TSMC (China) |
| 10:00-10:20 | 格芯技术助力从云到端联接数字化未来 GlobalFoundries Connects the Digitalized Future from Cloud to Edge | 朱宇，格芯中国区业务发展总监 Fisher Zhu, Director of China Business Development, GlobalFoundries |
| 10:20-10:40 | 面向高速运算和大容量存储芯片的解决方案——武汉新芯三维集成技术 XMC 3D IC Technology: Solutions for high-speed computing and high-density memory chips | 沈亮，武汉新芯集成电路制造有限公司代工市场销售部总监 Neo Shen, Director of Foundry Business, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. |
| 10:40-11:00 | 助力FAB无人化、智慧化生产 Accelerate the Intelligent and Unmanned Manufacturing of FAB | 马巍，上海哥瑞利软件有限公司北京分公司总经理、RCM产品总监 Wayne Ma, General Manager of Beijing Branch, RCM Product Director, Shanghai Glorysoft Co., Ltd. |
| 11:00-11:20 | 服务初创芯片企业流片探索 Exploration of Tape-out Service for IC Start-ups | 王龙，摩尔精英流片服务总监 Long Wang, Director of Tape-out Service, MooreElite |
| 11:20-11:40 | 全球领先创新中心专家为您所用，助力中国芯片设计 From Prototype to Mass Production - utilize World’s Leading Innovation Center Professionals as Your AssetinIC Design | 任旭，欧洲微电子研究中心业务发展经理 Xu Ren, Business Development Manager, imec |
| 11:40-12:00 | 深耕特色工艺，引领智能传感——华润上华特色工艺技术发展介绍 The Overall Introduction of CSMC Specialty Process Technologies Development Status | 张森，华润微电子代工事业群研发助理总经理 XSen Zhang, Assistant General Manager of Foundry Business Group, China Resouces Microelectronics Limied |
| 12:00-12:20 | 数据湖平台建设助力晶圆制造缺陷分析 The Architecture of Data Lake Platforms Benefits the Defect Analysis in Wafer Manufacturing | 张澄宇，锱云（上海）物联网科技有限公司CEO Stone Zhang, CEO, Ziyun (Shanghai) IoT Technology Co., Ltd. |
| 12:20-12:25 | 幸运抽奖Lucky Draw | |
| 12:25-13:10 | 幸自助午餐 Buffet Lunch | |
DAC 2021 Outreach | ||
| 13:10-13:30 | 设计自动化会议介绍 Introduction to Design Automation Conference | 刘大江，重庆大学副教授 Dajiang Liu, Associate Professor, Chongqing University |
VC and IC Design Industry | ||
Moderator: Jian Sun, Vice General Secretary, CSIA-ICCAD | ||
| 13:30-13:50 | 半导体产业投资的思考 China IC Industry Investment Opportunities Suggestions | 黄庆博士，华登国际董事总经理 Dr. Hing Wong, Managing Director(MD), Walden International |
| 13:50-14:10 | 基业长青 资本助力 How Capital Support a Great Boom | 王心然，中芯聚源股权投资管理（上海）有限公司合伙人 Xinran Wang, Partner, China Fortune-tech Capital Co., Ltd. |
| 14:10-14:30 | 构建产业生态，提升投资能力 Building Industrial Ecology and Improving Investment Capacity | 苗军，北京中关村集成电路设计园发展有限责任公司董事长 Jun Miao, Chairman, Beijing Zhongguancun IC Design Park Development Co., Ltd. |
| 14:30-14:50 | 注册制下的半导体产业投资探讨 Investment in Semiconductor Industry under Registration System | 祁耀亮，元禾璞华董事总经理 Leo Qi, MD, Hua Capital |
| 14:50-15:10 | 石基起堤，溪源汇海 Stone to Build Levee, Creek to form Sea | 高峰，北京石溪清流投资有限公司合伙人 Feng Gao, Partner, Stony Creek Capital Co., Ltd. |
| 15:10-15:30 | 半导体热潮下中国半导体发展和投资机遇 Semiconductor Development and Investment Opportunities in China under the Semiconductor Upsurge | 苏仁宏，湖杉资本创始合伙人 Tony Su, Founding Partner CEO, Allin Capital |
| 15:30-15:50 | 半导体创业企业全周期金融需求解决方案 Full-cycle Financial Support for IC Startups | 黄卫其，摩尔精英产融服务副总裁 David Huang, Vice President of Financial Service, MooreElite |
Free Discussion - Industry VC is Being Key Factor to Promote Semiconductor Industry Innovation Gradually | ||
| 15:50-16:50 | 研讨嘉宾：陈大同、黄庆、王心然、祁耀亮、高峰、苏仁宏、黄卫其等 从某种意义上来说，目前中美之争表面是贸易之争，核心是科技之争，科技之争就是创新之争，创新之争就是创业之争，创业之争就是创投之争； 当前的国际环境，将中国集成电路行业发展的机遇与挑战同时放大到前所未有的程度，技术、市场、人才、资金各方面资源的快速聚集，其中创业投资行业的参与起到了至关重要的作用。 参与本次自由研讨嘉宾，都是在中国集成电路创业投资领域最活跃最成功的投资机构的投资家，他们将给大家带来怎样的思考与见解呢？ Honored Guests: Dr. Datong Chen, Dr. Hing Wong, Mr. Xinran Wang, Mr. Leo Qi, Mr. Feng Gao, Mr. Tony Su, Mr. David Huang, etc. In a certain way, the present disputes between China and the USA are on trade on the surface, the core is focusing science and technology, innovation, start-up, even tech industry VC Investments disputes. At present, International environment is zooming China IC industry development opportunities and challenges to unprecedented situation. Technology, market, talent, capital, etc are rapidly gathering. Besides, industry VC investors are important and influential. Today the panelists are all most active and successful China IC industry VC investors.What will share today? We are expecting. | |
| 16:50-16:55 | 幸运抽奖Lucky Draw | |
| 18:30-20:00 | 闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点：重庆悦来国际会议中心一楼喜悦厅 Site: Fiesta Function, Chongqing Yuelai International Convention Center | |
Dec. 11, Friday, 2020 专题论坛（五） Subject Forum (V) 地点：重庆悦来国际会议中心一楼欣悦厅B Venue: Felicity Function B, 1F, Chongqing Yuelai International Convention Center | ||
|---|---|---|
| 时间 Time | 内容 Contents | 演讲人 Lecturer |
Advanced Packaging and Testing | ||
Moderator: Xiaohua Fan, Vice General Director, CSIA-ICCAD | ||
| 08:40-09:00 | 华宇电子在封测产业的布局与发展 Distribution and Development of Hisemi in IC Assembly & Testing Industry | 彭勇，池州华宇电子科技有限公司总经理 Peng Yong, General Manager, Chizhou Hisemi Electronics Technology Co., Ltd. |
| 09:00-09:20 | 5G大时代：芯片测试的变革和挑战 5G Big Time: Changes and Challenges of Chip Testing | 宋鑫，爱德万测试（中国）管理有限公司专家工程师 Xin Song, Expert Engineer, Advantest (China) Co., Ltd. |
| 09:20-09:40 | 先进封装的协同设计与集成开发 Advanced Package Co-design and Integration Development | 李宗怿，长电科技中国区研发中心副总经理 Zongyi Li, Vice General Manager of China R&D Center, JCET Group Co., Ltd. |
| 09:40-10:00 | SIP封装集成技术及发展趋势 SIP Integrated Technology and Development Trend | 徐玉鹏，甬矽电子（宁波）股份有限公司工程副总经理 Alvin Xu, CTO, Forehope Electronic (Ningbo) Co., Ltd. |
| 10:00-10:20 | 微型化真无线蓝牙系统级封装解决方案 SiP & TWS SiP solutions | 林志毅，日月光处长 Charlie Lin, Director, ASE |
| 10:20-10:40 | 紧跟市场趋势，助力客户创共赢 Following up the Market Trends, Help Customers Create a Win-win Situation | 乔春英，通富微电子股份有限公司市场总监 Elsa Qiao, Marketing Dir, TongFu Microelectronics Co., Ltd. |
| 10:40-11:00 | 创新可靠性工程方法，助推国产芯片高质量发展 Promoting the High-quality Development of Domestic Chips by Innovating the Reliability Engineering Methods | 罗道军，工业和信息化部电子第五研究所分析中心主任 Daojun Luo, Director, CEPREI RAC |
| 11:00-11:20 | 移动时代——超薄集成电路面临的机遇与挑战 Opportunities and Challenges for Ultra-thin Integrated Circuits in the Mobile Era | 何忠亮，深圳市鼎华芯泰科技有限公司董事长 Zhongliang He, Chairman, Shenzhen Ding Waa Sam Tai Technology Co., Ltd. |
| 11:20-11:40 | 几种当前主流芯片的测试验证方法 Methods to Verify Chipset in the Industry | 任彦楠，是德科技(中国)有限公司大中华区运营经理 Yan-nan Ren, Sales Program and Operation Manager of GCS (Greater China Sales), Keysight Technologies |
| 11:40-12:00 | 先进SiP封装技术 Advanced SiP Package | 刘卫东，华天科技技术市场总监 Wade Liu, Technical & Marketing Director, HT-Tech |
| 12:00-12:05 | 幸运抽奖Lucky Draw | |
| 12:05-13:10 | 自助午餐Buffet Lunch | |
Moderator: Xiufa Xu, Vice General Secretary, CSIA-ICCAD | ||
| 13:10-13:30 | 领跑全球测试，助力中国芯 Leader in Testing, Partner in China Semiconductor Industry | 宋涛，泰瑞达（上海）有限公司销售副总经理 Jason Song, Sales Deputy GM, Teradyne(Shanghai) Co., Ltd. |
| 13:30-13:50 | 具有成本效率的MCU/IoT射频测试 Cost Effective RF Test for MCU Chips | 陈文建，致茂电子股份有限公司资深销售经理 Wenjian Chen, Senior Sales Manager, Chroma (Shanghai) Co., Ltd. |
| 13:50-14:10 | 先进封装及其对环氧塑封料的要求 The Advanced Packaging and Its Requirements on EMC | 谭伟，江苏华海诚科新材料股份有限公司研发经理 Wei Tan, R&D Manager, Jiangsu HHCK Advanced Materials Co., Ltd. |
| 14:10-14:30 | "芯"体检套餐 - 集成电路先进封装之 DPA 应用与挑战 Application and Challenge of DPA in Advanced Integrated Circuit Packaging | 黄志国，苏试宜特（上海）检测技术有限公司副总经理 Russell Huang, VP, CHINAiSTI (Shanghai) Testing Technology Co., Ltd. |
| 14:30-14:50 | 中芯长电先进封装技术介绍 SJSemi’s Advanced Package Technology Introduction | 陈明志，中芯长电资深总监 Max Chen, Sr. Director, SJSemi |
| 14:50-15:10 | 物联网模块COS下载和ID地址写入实现方法 The Method of IOT Module COS Download & ID Address Writing | 翁小安，北京华安天成智能技术有限公司总经理 Xiaoan Weng, CEO, Beijing Huaan Tiancheng Intelligent Technology Co., Ltd. |
| 15:10-15:30 | 奈米器件的失效分析挑战 Challenge in Failure Analysis of Nano Device | 陈志荣，蔚思博检测协理 Phil Chen, Director, VESP Technology Co., Ltd. |
| 15:30-15:50 | 数字化转型在半导体产品开发中的应用 The Future of Semi Test: Applying Digital Transformation Technologies to Semiconductor Product Development | 何为，NI全球半导体业务拓展总监 Pearl He, Global Semiconductor BDM Head, NI |
| 15:50-16:10 | 先进工艺赋能系统级封装，满足市场需求 System in Package (SiP) Enables Advanced Technology to Satisfy Market Demands | 刘一波，安靠科技市场策略副总监 Elbert Liu, Deputy Director Strategic Marketing, Amkor Technology, Inc. |
| 16:10-16:30 | 质量 产能 效益，探索中国半导体封测新格局 Quality, Capacity, Benefit, Explore the New Ecology of China's OSAT | 张君浩，摩尔精英测试服务副总裁 Roy Zhang, Vice President of Testing Service, MooreElite |
| 16:30-16:50 | 邓钦球，苏州华碧微科检测技术有限公司研发经理 Andy Deng, R&D Manager, Suzhou FALAB Test Technology Co., Ltd. | |
| 16:50-17:10 | 扇出型板级封装，实现经济高效集成的异构系统封装途径 Fan Out Panel Level Packaging, a Path to Cost Efficient Heterogeneous Integration for SiP Modules | 赵春燕，奥特斯科技（重庆）有限公司研发中心工程技术专家 Allen Zhao, R&D Engineering Specialist, AT&S Technology (Chonqing) Co., Ltd. |
| 17:10-17:15 | 幸运抽奖Lucky Draw | |
| 18:30-20:00 | 闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点：重庆悦来国际会议中心一楼喜悦厅 Site: Fiesta Function, Chongqing Yuelai International Convention Center | |
Dec. 11, Friday, 2020 专题论坛（六） Subject Forum (VI) 地点：重庆悦来国际会议中心一楼欣悦厅C Venue: Felicity Function C, 1F, Chongqing Yuelai International Convention Center | ||
|---|---|---|
| 时间 Time | 内容 Contents | 演讲人 Lecturer |
Chongqing IC Innovation and Development Forum | ||
Moderator: Leader of Chongqing Economic and Information Technology Commission | ||
| 09:00-09:10 | 介绍嘉宾 Introduce Guests | |
| 09:10-09:20 | 重庆市领导致辞 Address, Leader of Chongqing | |
| 09:20-09:40 | 嘉宾致辞 Address, Guests | |
| 09:40-09:55 | “高科创芯”集成电路产业智库发布及揭牌仪式 Launch and Unveiling Ceremony of "Gaoke Chuangxin" IC Industry Think Tank Press Conference of IC Industry Think Tanks, Signing and Opening Ceremony | |
| 09:55-10:15 | 射频集成电路助力万物互联 RF integrated Circuit Helps Everything Interconnected | 徐骅，西南集成电路设计有限公司副总经理 Hua Xu, Vice General Manager, Southwest Integrated Circuit Design Co., Ltd. Chongqing |
| 10:15-10:35 | 集成电路产业发展与人才培养 Integrated Circuit Industry Development and Personnel Training | 杨虹，重庆邮电大学光电学院副院长 Hong Yang, Assistant Dean of PE College, Chongqing University of Posts and Telecommunications |
| 10:35-10:55 | 当前半导体行业的投资热点与思考 Investment Hotspots and Viewpoints of Semiconductor Industry | 陈大同，北京清芯华创投资管理有限公司投委主席 Datong Chen, Chairman of Investment Committee, Hua Capital Management Co., Ltd. |
| 10:55-11:15 | 射频采样数据转换器技术及发展趋势 RF Sampling Data Converter Technology and Development Trend | 付东，重庆吉芯科技有限公司副总经理 Dongbing Fu, Vice General Manager, Chongqing Giga Chip Technology Co., Ltd. |
| 11:15-11:35 | 12吋功率器件的产业现状及发展趋势 Present Situation and Development of Power Devices Made in 12 inch Fabs | 李勇强，华润微电子（重庆）有限公司 首席专家 John Li, Chief Scientist, China Resources Microelectronics (Chongqing) Co., Ltd. |
| 11:35-11:50 | 首创高科重庆泛集成电路科技园及产业服务 Introduction for the IC Park in Western Science City of Capital Park and Industrial Service | 安侠睿，北京首创高科技发展有限公司副总经理 Xiarui An, Vice General Manager, Beijing Capital Park Co., Ltd. |
| 11:50-12:10 | 高性能模拟集成电路设计——电场传感器接口及驱动电路 High Performance Analog IC Design - Interface and driving circuit of electric field sensor | 杨勇刚博士，重庆东微电子股份有限公司总经理 Dr. Yonggang Yang, CEO, Eastmicro Electronics Chongqing Co., Ltd. |
| 12:10-12:15 | 幸运抽奖Lucky Draw | |
| 12:15-13:10 | 自助午餐 | |
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